µ¿°æ ÀüÀÚ ÅؽºÅ¸ÀÏ/¿þ¾î·¯ºí ¹Ú¶÷ȸ E-TEXTILE/WEARABLE 2024
1.
Àü½Ãȸ¸í :
µ¿°æ ÀüÀÚ ÅؽºÅ¸ÀÏ/¿þ¾î·¯ºí ¹Ú¶÷ȸ (E-TEXTILE/WEARABLE 2024)
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E-TEXTILE/WEARABLE (µ¿°æ ÀüÀÚ
ÅؽºÅ¸ÀÏ/¿þ¾î·¯ºí ¹Ú¶÷ȸ)
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JPCA
SHOW (µ¿°æ
ÀüÀÚȸ·Î»ê¾÷ ¹Ú¶÷ȸ)
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MICROELECTRONICS
SHOW (µ¿°æ
ÃÖ÷´Ü ÀüÀÚ
±â¼ú ¹Ú¶÷ȸ)
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JISSO
PROTEC (µ¿°æ
½ÇÀå
ÇÁ·Î¼¼½º Å×Å©³î·¯Áö ¹Ú¶÷ȸ)
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METAVERSE
DEVICE EXPO (µ¿°æ
¸ÞŸ¹ö½º ÀåÄ¡ ¹Ú¶÷ȸ)
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WIRE
JAPAN SHOW (µ¿°æ
¿ÍÀ̾î
¹× ÄÉÀÌºí ¹Ú¶÷ȸ)
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ELECTRONICS
COMPONENT & UNIT SHOW (µ¿°æ
ÀüÀÚºÎÇ° ¹× ÀåÄ¡ ¹Ú¶÷ȸ)
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SMART
SENSING (µ¿°æ
½º¸¶Æ®¼¾½Ì ¹Ú¶÷ȸ)
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AUTOMATED
SOLUTION EXHIBITION (µ¿°æ
ÀÚµ¿È ¼Ö·ç¼Ç ¹Ú¶÷ȸ)
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EDGE
COMPUTING (µ¿°æ
¿¡Áö ÄÄÇ»Æà ¹Ú¶÷ȸ)
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Àü½Ãȸ¸í |
µ¿°æ ÀüÀÚ
ÅؽºÅ¸ÀÏ/¿þ¾î·¯ºí ¹Ú¶÷ȸ (E-TEXTILE/WEARABLE 2024)
|
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Electronics Packaging and Circuits Association(JPCA) https://www.jpcashow.com/show2024/en/ |
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
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Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
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Àü½ÃÇ°¸ñ |
- A mix
e-textile of electronic technology, fiber and clothing, General technology for
smart textile, stretchable and wearable, Textile material, Conductive material,
Knitting, Weaving technology, Print marking technology, Films
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Àü½Ãȸ¸í |
µ¿°æ ÀüÀÚȸ·Î»ê¾÷ ¹Ú¶÷ȸ
(JPCA SHOW
2024)
|
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Electronics Packaging and Circuits Association (JPCA) https://www.jpcashow.com/show2024/en/
|
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
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Àü½ÃÇ°¸ñ |
[PWB
Tech 2024 (ÇÁ¸°Æ® ¹è¼±ÆÇ ±â¼ú Àü½Ãȸ)]
- Products
Single-sided, double-sided, and multi-layered printed wiring boards, flexible
printed wiring boards, build-up wiring boards, flex-rigid printed wiring boards,
ceramic wiring boards, metal (copper, aluminum, etc.) based printed wiring
boards, other printed wiring boards, and related books, etc.
- Design Technologies
Functional design (circuit design for functional requests) technology, logical
design (circuit diagram design) technology, parts layout design and bill of
materials, pattern design, layout design, structure design, various design
support tools (for the above listed technologies), signal integrity design
support tools, power integrity design support tools, electromagnetic field
analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property
simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
- Reliability and Inspection Technologies
Inspection and assessment contract services, various kinds of inspection
devices, various testing devices, evaluation/analysis systems, inspection jigs,
and related books, etc.
- Main Materials
Rigid copper clad laminates (CCLs), flexible copper clad laminates (FCCLs),
shield boards, multi-layer PWB prepregs, copper foil with adhesive, ceramic
board materials, copper/aluminum board materials, special board materials,
various insulating materials, solder mask materials, and related books, etc.
- Processing Technologies, Materials and Equipment
Plating, mold casting, hole drilling, plate making, plating chemicals, surface
processing chemicals, etching chemicals, various inks, pastes, various tools,
dry film resist, and related books, etc
- Manufacturing Equipment
Chemical processing device, photolithography exposure equipment, machining
equipment, transportation equipment, coating equipment, plasma processing
equipment, laser processing devices, printing equipment, and related books, etc.
- Environmental Systems
Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (such as heat exchangers/waste
heat utilization systems/thermal storage systems), and related books, etc.
- Distribution Systems
Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
[Module
Japan 2024 (¹ÝµµÃ¼ ÆÐŰ¡·ºÎÇ°
³»Àå ±â¼ú Àü½Ãȸ)]
- Products
Rigid substrate, build-up substrate, tape substrate, COF/TAB, ceramic substrate,
lead frame, wafer-level package, two-dimensional package (SiP), three-dimension
packages, silicon interposer, glass interposer, MEMS interposer (with rewiring
layer), functional layer interposer, rigid active device embedded substrate,
flexible active device embedded substrate, rigid passive device embedded
substrate, flexible passive device embedded substrate, module device embedded
substrate, IPD device embedded substrate, MEMS device embedded substrate, LTCC,
bare dies, WLCSP/WLP, BGA (CSP), LGA, QFN, Chip parts, complex chip parts, IPD,
modules of various types, MEMS, books on related topics, and related books, etc.
- Design Technologies
Functional design (circuit design for functional requests) technology, logical
design (circuit diagram design) technology, parts layout design and bill of
materials, pattern design, layout design, structure design, various design
support tools (for the above listed technologies), signal integrity design
support tools, power integrity design support tools, electromagnetic field
analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property
simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
- Reliability and Inspection Technologies
Inspection and assessment contract services, various kinds of inspection
devices, various testing devices, evaluation/analysis systems, inspection jigs,
and related books, etc.
- Main Materials
Core multi-layered PWBs, organic package substrate materials, various alloys
(Fe-Ni, Cu), polyimide film/tape, ceramic board materials, silicon wafers, glass
blanks, organic/inorganic rewiring layer and materials, metal plates/radiator
plates, metal stiffener plates, semiconductor insulating layer materials,
optical wave guide materials, solder mask materials, organic/inorganic board
(insulating) materials, copper foil carriers, film carriers, and related books,
etc.
- Processing Technologies, Materials and Equipment
Plating, mold casting, hole drilling, plate making, plating chemicals, surface
processing chemicals, etching chemicals, various inks, pastes, various tools,
dry film resist, die bonding materials, bonding wire, solder balls, bump
materials, metal barrier materials, sealing resin, underfill, coating materials,
various adhesives agents, conductive/nonconductive film,
conductive/nonconductive paste, metal masks, and related books, etc.
- Manufacturing Equipment
Chemical processing device, photolithography exposure equipment, machining
equipment, transportation equipment, coating equipment, cleaning equipment,
back-grinding equipment, CMP equipment, dicing equipment, wire bonders, die
bonders, flip chip bonder, dispenser, plasma processing equipment, laser
drilling equipment, RIE (Reactive Ion Etching) equipment, laser marking
equipment, laser trimming machine, thermosetting device, printing equipment, and
related books, etc.
- Environmental Systems
Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (including heat exchangers/waste
heat utilization systems/thermal storage systems) and related books, etc.
- Distribution Systems
Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
[EMS
Japan 2024 (±â±â·¹ÝµµÃ¼ ¼öŹ»ý»ê
½Ã½ºÅÛ Àü½Ãȸ)]
- Products
Printed wiring mount board (printed wiring board on which electronic components
are mounted and electrically interconnected; eg., AV or digital home appliances,
mobile devices, automobiles, PCs and PC peripherals, household appliances and
industrial equipment, and motherboards for powered devices), mounted module
substrate (a module substrate on which electronic components are mounted and
electrically interconnected; eg., AV and digital home appliances, mobile
devices, automobile, PCs and PC peripherals, household appliances and industrial
equipment, and module boards and IC packages for powered devices), insertion
device mounted board, chip component mounted board, IC package mounted board,
wire bonding mounted board, TAB/COF mounted board, flip chip mounted board,
other electronic circuit boards, memory and storage devices, general-purpose
logic ICs, transistors, diodes, optical semiconductors, sensor/imagining
elements, high-frequency devices, microcomputers, ASIC, specific-purpose ICs
(for use in TVs, AV equipment, communications equipment, in-car devices, and
peripherals), general-purpose linear ICs (power supply ICs, motor drivers, LED
drivers, transistor arrays, operational amplifiers and comparators, intelligent
power devices (IPD), etc.), and related books, etc.
- Design Technologies
Packaging and structural design technologies, functional design technologies,
logical design technologies, part layout design technologies, bill of materials
(BOM), pattern design, layout design, various design support tools, 2D CAD, 3D
CAD, digital mock-up tools, knowledge management systems, plotters/printers,
CAM, process simulators, CAE (mechanism analysis, structure analysis,
thermo-fluid analysis, resin flow analysis, casting analysis, electromagnetic
field analysis, press analysis), analyzing service by contract, and related
books, etc.
- Reliability and Inspection Technologies
Electronic circuit mounted board/ semiconductor integrated circuit inspection
and assessment contract services, various kinds of electronic circuit mounted
board and semiconductor integrated circuit inspection devices, various kinds of
electronic circuit mounted board and semiconductor integrated circuit testing
devices, various kinds of electronic circuit mounted board and semiconductor
integrated circuit evaluation and analysis systems, burn-in devices, logical
testing devices, memory test devices, linear testing systems, inspection jigs,
testing, inspection and assessment contract services, and related books, etc.
- Main Materials
Electronic circuit boards, module substrates, wafers, mask materials, solder,
lead frames, molding compounds, packaging materials, product structural
components, other main materials used in the manufacture of electronic circuit
mounted boards, development services by consignment, and related books, etc
- Manufacturing Equipment, and Processing Materials and Equipment
Processing equipment and materials such as agents, chemicals, pastes, films,
jigs and tools for manufacturing printed wiring mounted boards (including for
processes such as mounting, embedding, insertion and assembly of parts and
devices), processing equipment and materials such as agents, chemicals, pastes,
films, jigs and tools for manufacturing mounted module substrates (for processes
such as die layering and stacking, embedding and assembly, dicing, bonding,
packaging, sealing, marking, soldering and other mounting and assembly
processes), processing equipment and materials such as agents, chemicals,
pastes, films, jigs and tools for manufacturing semiconductor integrated
circuits (for processes such as single-crystal processing/exposure,
depiction/resist processing/etching/heat treatment/ thin film formation/ion
implantation/ washing and drying, etc.), various types of machine tools for
device production, casting, defining/washing equipment, various transportation
systems and equipment, pure water/ liquid agent/water treatment equipment,
various types of gas devices, clean rooms, control equipment, FA systems, and
related books, etc.
- Environmental Systems
Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (including heat exchangers/waste
heat utilization systems/thermal storage systems) and related books, etc.
- Distribution Systems
Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
|
Àü½Ãȸ¸í |
µ¿°æ ÃÖ÷´Ü ÀüÀÚ ±â¼ú
¹Ú¶÷ȸ
(MICROELECTRONICS SHOW 2024) |
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Institute of Electronics Packaging (JIEP) https://www.jpcashow.com/show2024/en/ |
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Leading-edge products based on high-density or high-frequency packaging
technologies, high-density substrate and interposers, component contained
boards, semiconductor chips, systems in package (SiP), systems on chip (SoC),
indication/optical devices and sensors, materials related to high-density
packaging, pastes, lead-free solder and junction materials, sealing resins,
adhesives,, and underfill materials, anti-heat materials, high frequency ready
polymer, systems and devices related to high-density packaging such as bonders
(e.g. wire bonders, die bonders, and LCD/COG bonders), dispensers, flip chip
(FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB
systems and equipment and production facilities, and related books,
etc.
|
Àü½Ãȸ¸í |
µ¿°æ ½ÇÀå ÇÁ·Î¼¼½º Å×Å©³î·ÎÁö
¹Ú¶÷ȸ
(JISSO PROTEC
2024) |
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Robot Association (JARA) https://www.jissoprotec.jp/ |
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Electronic Component Placement Machines and related Equipment and Systems
Electronic component placement machines, electronic component insertion machines, screen printers, soldering equipment (reflow oven), and dispensers
- Packaging related Equipment and Systems
Transfer systems, taping machines and materials, bulk feeders and other feeders, and automatic assembly machines
- Semiconductor Packaging Machines and Systems
Wire bonders, die bonders, flip chip packaging systems, LCD/COG bonding systems, BGA/ILB systems, and COB systems
- Inspection/Test Equipment
Automated optical inspection equipment, inspection/measuring equipment associated with semiconductor manufacturing, and inspection/measuring equipment associated with other packaging
- Packaging Design Systems
Design tools, production optimizing software, and packaging programming devices
- Packaging Devices/Components and related Materials
SMD, semiconductor package parts, small electronic parts, chip parts, connectors, sockets, switches, and bulk supplies
- Packaging Device Packaging Materials
Taping reels, carrier tape, TAB tape/reel, magazine sticks, IC trays, and bulk cases
- Packaging Joining Systems
Soldering devices, solder/joining materials, and underfill materials
- High Frequency Compatible Devices, Components, and Materials
Devices, components, and materials
- Environment related Devices and Materials
Devices and materials associated with the zero emission process and waste treatment recovery
- Publications
Related books in every field
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Àü½Ãȸ¸í |
µ¿°æ
¸ÞŸ¹ö½º ÀåÄ¡ ¹Ú¶÷ȸ (METAVERSE DEVICE EXPO 2024)
|
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Institute of Electronics Packaging (JIEP)
https://www.jpcashow.com/show2024/en/ |
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Products
and technologies related to the metaverse£¨Semiconductor£¨Processor,
Memory, Sensor), AR?VR?MRgoggle/Display£¨micro LED,
OLED/Camera/Headset/Controller/Cooling device etc)
|
Àü½Ãȸ¸í |
µ¿°æ
¿ÍÀÌ¾î ¹× ÄÉÀÌºí ¹Ú¶÷ȸ (WIRE JAPAN SHOW 2024)
|
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Electronics Packaging and Circuits Association(JPCA) https://www.jpcashow.com/show2024/en/ |
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Industrial equipment and communications, such as electric wires, cables,
connectors, electric wire processors, AWM, wire harness processors, and electric
wire or cable measuring instrument, and related books, etc.
|
Àü½Ãȸ¸í |
µ¿°æ ½º¸¶Æ®¼¾½Ì
¹Ú¶÷ȸ
(SMART
SENSING 2024) |
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
JTB
Communication Design Co., Ltd. https://www.smartsensingexpo.com/index.html
|
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Sensors,
Sensor Nodes, Semiconductors, Parts and Devices, Electronics,
Telecommunications Devices, Network Systems, Software, Data Platform, Power
Sources, Other Related Devices,Technologies and Services
|
Àü½Ãȸ¸í |
µ¿°æ ÀÚµ¿È
¼Ö·ç¼Ç ¹Ú¶÷ȸ (AUTOMATED
SOLUTION EXHIBITION 2024)
|
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
JTB
Communication Design Co., Ltd. https://www.smartsensingexpo.com/index.html
|
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Unmanned
technology/solutions, or labor-saving/remote/automated/non-contact
technologies/solutions for unmanned operations¡¡(Monitoring system/remote control
system/advanced driving support system/deep learning/non-contact/touchless/unmanned
sales service/AR/anomaly detection/face recognition/AI, etc.)
|
Àü½Ãȸ¸í |
µ¿°æ
ÀüÀÚºÎÇ° ¹× ÀåÄ¡ ¹Ú¶÷ȸ (ELECTRONICS
COMPONENT & UNIT SHOW 2024)
|
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Electronics Packaging and Circuits Association(JPCA) https://www.jpcashow.com/show2024/en/ |
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Semiconductors,
Electronic Devices, Sensors, Mechanical Devices, FA control equipments,
Measuring instruments, Power Sources, IoT and M2M Solution
|
Àü½Ãȸ¸í |
µ¿°æ ¿¡Áö
ÄÄÇ»Æà ¹Ú¶÷ȸ (EDGE
COMPUTING 2024)
|
°³ÃֱⰣ |
2024
³â 6 ¿ù 12 ÀÏ ~ 6 ¿ù 14 ÀÏ |
Àü½ÃÀå¼Ò |
Big Sight |
ÁÖ
ÃÖ |
Japan Electronics Packaging and Circuits Association(JPCA) https://edgecomputing.jp/ |
°³ÃÖ±Ô¸ð |
¾à 517
¿©°³»ç Âü°¡ (2023³â
±âÁØ)
|
Âü°ü°´¼ö |
¾à 48,018
¿©¸í Âü°¡ (2023³â ±âÁØ)
|
Àü½ÃÇ°¸ñ |
- Edge
solutions in general such as low latency, high security, and low traffic (board
computers, single board computers, edge devices, OS, edge AI, applications,
image analysis, edge security, various systems, etc.)
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BÆÀ (1±ÞÈ£ÅÚ)
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TOKYO
DOME
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ARIAKE
WASHINGTON
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ÀÛ¼ºÈÄ icetour@icetour.co.kr
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