³ª°í¾ß ÀÚµ¿Â÷±â¼ú ¹Ú¶÷ȸ AUTOMOTIVE WORLD NAGOYA 2024
³ª°í¾ß ÀÚµ¿Â÷±â¼ú ¹Ú¶÷ȸ AUTOMOTIVE WORLD NAGOYA 2023
1.
Àü½Ãȸ¸í : ³ª°í¾ß ÀÚµ¿Â÷±â¼ú ¹Ú¶÷ȸ AUTOMOTIVE WORLD
NAGOYA 2024
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AUTOMATIVE
WORLD NAGOYA 2024 (³ª°í¾ß
ÀÚµ¿Â÷ ±â¼ú ¹Ú¶÷ȸ)
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CAR-ELE
JAPAN NAGOYA (³ª°í¾ß
ÀÚµ¿Â÷ ÀüÀÚ±â¼ú ¹Ú¶÷ȸ)
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EV
JAPAN NAGOYA (³ª°í¾ß
Àü±â ¹× ÇÏÀ̺긮µå ¹Ú¶÷ȸ)
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Lightweight
Technology Expo (³ª°í¾ß
ÀÚµ¿Â÷ °æ·®È ¹Ú¶÷ȸ)
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CAR-MECHA
JAPAN NAGOYA (³ª°í¾ß
ÀÚµ¿Â÷ ºÎÇ° °¡°ø±â¼ú ¹Ú¶÷ȸ)
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Software-Defined
Vehicle Expo (³ª°í¾ß SDV ¹Ú¶÷ȸ)
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FACTORY
INNOVATION WEEK NAGOYA (³ª°í¾ß
ÆÑÅ丮 À̳뺣ÀÌ¼Ç À§Å©)
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RoboDEX NAGOYA (³ª°í¾ß
·Îº¿ ¹Ú¶÷ȸ) |
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Smat
Factory Expo NAGOYA (³ª°í¾ß
½º¸¶Æ® ÆÑÅ丮 ¹Ú¶÷ȸ)
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Green
Factory Expo NAGOYA (³ª°í¾ß
±×¸°ÆÑÅ丮 ¹Ú¶÷ȸ)
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SMART
LOGISTICS EXPO NAGOYA (³ª°í¾ß ½º¸¶Æ®
¹°·ù ¹Ú¶÷ȸ)
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NEPCON
NAGOYA (³ª°í¾ß ÀüÀÚÁ¦Á¶ ¹Ú¶÷ȸ)
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Àü½Ãȸ¸í |
³ª°í¾ß ÀÚµ¿Â÷±â¼ú ¹Ú¶÷ȸ (AUTOMATIVE WORLD NAGOYA 2024) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd.
https://www.automotiveworld.jp/nagoya/en-gb.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
ÀÚµ¿Â÷
ÀüÀÚÁ¦Ç°. EV/HV/FCV. ÀÚÀ²ÁÖÇà. °æ·®
¹× ºÎÇ° °¡°ø ±â¼ú µî°ú °°Àº ±¤¹üÀ§ÇÑ Ã·´Ü
ÀÚµ¿Â÷ ±â¼úÀÌ ÇÑÀÚ¸®¿¡ ¸ðÀÌ´Â ¿ÀÅä¸ðƼºê
Àü¹® Àü½Ãȸ.
ÃÑ5°³ÀÇ
Àü¹® Àü½Ãȸ °³ÃÖ
- CAR-ELE
JAPAN
- EV
JAPAN
- AUTOMOTIVE
LIGHTWEIGHT TECHNOLOGY EXPO
- CAR-MECHA
JAPAN
- SOFTWARE-DEFINED
VEHICLE EXPO
|
Àü½Ãȸ¸í |
³ª°í¾ß ÀÚµ¿Â÷
ÀüÀÚ±â¼ú ¹Ú¶÷ȸ CAR-ELE JAPAN NAGOYA 2024 ;
International Automotive Electronics Technology
Expo |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.automotiveworld.jp/hub/en-gb/about/car-ele-japan.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- AUTOMOTIVE
COMPONENTS & IN-VEHICLE SYSTEMS
(ÀÚµ¿Â÷ºÎÇ° ¹× Â÷·® ³» ½Ã½ºÅÛ) Engine
Control System. Safety/Comfort Control
System. In-vehicle Networking System.
Communication/ITS-related System. Chassis
Control System
- SEMICONDUCTORS,
ELECTRONIC COMPONENTS & DEVICES
(¹ÝµµÃ¼,
ÀüÁöºÎÇ° ¹× ÀåÄ¡) In-vehicle
Semiconductors. Capacitors. Condensers.
Sensors. Connectors/Cables/Harnesses.
Batteries. Resistors. In-vehicle PCBs.
Touchpanels/Diplay Modules (LCD/ FED/
VFD). Camera Modules. Communication
Modules. Fine Processing Technologies
- TESTING
TECHNOLOGIES (Å×½ºÆ® ±â¼ú)
ECU Testing Tools/Software.
ECU Diagnosis and Vertification
Services. Testing, Inspection and Analysis
Devices/Software for In-vehicle Networking
System. CAE Software. Debuggers
- ECU
MANUFACTURING & TESTING TECHNOLOGY
(ECU
Á¦Á¶ ¹× Å×½ºÆ® ±â¼ú) (1)
ECU MANUFACTURING Mounters.
Dispensers. Soldering Machines. Rework
Machines. Resin Molding. Laser Cutting
Machines (2) SMT MATERIALS Soldering Materials.
PCB Materials.
Adhesives, Thermally Conductive Materials (3)
INSPECTION EQUIPMENT
Visual Inspection Equipment/AOI.
Solder
Pate Inspection Equipment. X-ray Inspection
Equipment. Testers. 3D Measuring Machines.
Repair System (4) Contract SMT
/ Contract
Manufacturing Services
- IN-VEHICLE
SOFTWARE DEVELOPMENT
(1) DEVELOPMENT
TOOLS Molding
Tools. Design Support Tools. Requirement
Management Tools. Source Code Management
Tools. State Transition Management Tools.
Configuration Management Tools. Prototype
Composers Tools. Model-based Development
Tools. Program Analysis Tools (2)
TESTING, INSPECTION Testing
Support Tools. Vertification Tools.
Driving Simulators (3) CONTRACT
DEVELOPMENT
- ADAS/
AUTONOMOUS DRIVING TECHNOLOGY (ADAS.
ÀÚÀ²ÁÖÇà±â¼ú)
(1) ADAS Pre-crash
Safety System. Rear Vehicle Monitoring(RVM)
System. Lane Departure Warning(LDW)
System. Night Vision System (2)
RADARS Millimeter-wave
Radars. Quasi-millimeter Wave Radars.
Infrared Lasers. Laser Radars (3)
SENSOR MODULES CMOS
Sensors. Ultrasonic Sensors. GPS Sensors.
Acceleration Sensors (4) CAMERA
MODULES Streo Cameras.
Infrared Cameras. Lens Modules (5)
IMAGE PROCESSING SYSTEM (6) SEMICONDUCTORS,
IC FPGA. Microcomputers.
Memory. ASIC (7) IN-VEHICLE OS (8)
R&D SUPPORT TOOLS/SERVICES ADAS Algorithm
Development Tools, Software EDA. EDA.
Driving Simulation System. Various Demonstration
& Testing Services
- EMC/NOISE
REDUCTION (EMC/³ëÀÌÁî °¨¼Ò)
(1) EMC
COMPONENTS Ferrite Cores.
Coils. RAM. EMC Filters. Noise Suppression
Parts (2) TESTING & MEASURING
EQUIPMENT EMC Measuring Systems. Electronic
Testing Devices. EMC Testing Services (3)
DESIGN & SIMULATION TECHNOLOGIES (4)
ANECHOIC CHAMBERS
- THERMAL
MANAGEMENT TECHNOLOGY (¿°ü¸® ±â¼ú)
(1)
THERMAL MANAGEMENT MATERIALS Aluminium
Substrates. Metalic Substrates. Heat
Dissipation Materials. Insulating Materials.
High Thermal Conductive Resins (2)
THERMAL MANAGEMENT COMPONENTS Heat
Sinks. Radiator Fins. Temperature Sensors.
Heat Pipes. Thermal Fuses (3)
THERMAL DESIGN / ANALYSIS TECHNOLOGIES Thermo-fluid
Analysis Software. Heat Conduction Analysis
Software. Thermal Characterisation Analyser
- DESIGN
ENGINEERING & DEVELOPMENT SOLUTION
(¼³°è ¿£Áö´Ï¾î¸µ ¹× °³¹ß ¼Ö·ç¼Ç) CAD.
CAM. CAE. Other related IT Solutions
for automotive design and development
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Àü½Ãȸ¸í |
³ª°í¾ß Àü±â
¹× ÇÏÀ̺긮µå ¹Ú¶÷ȸ EV JAPAN NAGOYA 2024
;
EV, HV & FCV TECHNOLOGY EXPO
|
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.automotiveworld.jp/hub/en-gb/about/ev-japan.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- DRIVE
SYSTEM (µå¶óÀÌºê ½Ã½ºÅÛ)
HV/EV Drive System.
In-wheel Motor System
- RECHARGEABLE
BATTERIES, NEXT-GENERATION BATTERIES
(ÃæÀü½Ä
¹èÅ͸®. Â÷¼¼´ë ¹èÅ͸®) Lithium
Ion Batteries. Lead Acid Batteries.
Lithium Polymer Batteries. NaS Batteries.
Thin Film Lithium Ion Batteries. Secondary
Air Batteries. Nickel Metal Hybrid(NiMH)
Batteries. Capacitors. Condensers. Nicad
Batteries. Battery Manufacturing Technologies.
Components & Materials for Batteries
- MOTOR
TECHNOLOGIES (¸ðÅÍ Å×Å©³î·ÎÁö½º)
(1)
AUTOMOTIVE MOTORS Permanent Magnet
Motors. Servo Motors. Induction Motors.
Linear Motors.
DC Motors. Reluctance Motors. Brushless
Motors. Variable-speed
Drive, Speed Reducers. Sepping Motors (2)
PARTS and MATERIALS
Magnets. Housing. Windering Wires.
Coils.
Brushes. Magnetic Steel Sheets. Commutators.
Bearing. Shafts. Cores. Rotors (3)
CONTROLLERS Microcontrollers.
Driver ICs. Control Modules/Software.
Sensor (4) MEASUREMENT and SIMULATION Torque Measuring.
Detection
Devices. Electromagnetic Field Analysis.
Static. Dynamic Measuring Devices. Heat
Transfer Analysis. Magnetic Measuring
Instruments. Motor Design Software (5)
PRODUCTION FACILITIES
Winding Machine. Welding Machines. Processing
Machines. Magnetizers
- INVERTERS,
PERIPHERALS (ÀιöÅÍ, ÁÖº¯±â±â)
(1)
INVERTERS, CONVERTERS DC-AC Inverters.
Buck-Boost Converters. DC-DC Converters.
PCUs (2) POWER DEVICES Diodes, Thyristors, Triacs.
IGBTs.
GTOs. SiC Devices. MOSFETs (3)
PASSIVE ELEMENTS Condensers.
Resistors (4) HEAT-RESISTANT PRODUCTS Heat Dissipation/ Resistance
Technologies. Cooling Devices (5)
INVERTER EVALUATION and TESTING SYSTEM
- CHARGERS
(ÃæÀü±â)
Battery
Swap Technologies. Contactless Charging
Technologies. EV Quick Chargers
- CONNECTORS,
HARNESSES (Ä¿³ØÅÍ, Çϳ׽º)
In-vehicle Connectors.
Charging Connectors. Wire Harnesses
|
Àü½Ãȸ¸í |
³ª°í¾ß ÀÚµ¿Â÷
°æ·®È ¹Ú¶÷ȸ (LIGHTWEIGHT TECHNOLOGY EXPO
NAGOYA 2024) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
https://www.automotiveworld.jp/hub/en-gb/
|
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- MATERIALS
(¼ÒÀç)
High-tensile
Steel Sheets. Thermoset Resins. High-strength
Rolled Steel Sheets. Polycarbonate Resins.
Aluminium Alloys. Rubbers, Thermoplstic
Elastomer. Magnesium Alloys. Carbon
Nanofiber. Titanium Alloys. Ceramics.
Carbon Fiber Reinforced Plastics. Lightweight
Glass. Thermoplastic Resins
- MOLDING.
PROCESSING TECHNOLOGIES, PROCESSING
EQUIPMENT (¼ºÇü. °¡°ø±â¼ú. °¡°øÀåºñ)
Press Works. Casting/Forging Technologies. Injection Molding
Equipment/Molding Technologies. Materials
Blending (Die Casting Products)/ Bonding
Technologies. Laser-welding Equipment.
Welding Technologies
- COMPONENTS.
MODULES (±¸¼º¿ä¼Ò. ¸ðµâ)
Weight-reduced Structure
Members using Light-metal Alloy(Body/Chassis
Components. Powertrain Components. Battery/
Inverter Cases). Weight-reduced Structural
Members using Resin Materials (Exterior
Body Panels. Exterior Parts. Interior
Parts. Engine Room Components. Fuel
Components. Electric Components)
- DISSIMILAR
MATERIAL JOINING TECHNOLOGY (ÀÌÁ¾Àç·á
Á¢ÇÕ±â¼ú)
Laser
Joining. Ultrasonic Joining. Friction
Joining. Diffusion Bonding. Adhesive
Bonding. Joining Strength Test. Analysis
Tool. Design Simulation Tool. Other
related technology for dissimilar material
joining
- OTHER
TECHNOLOGIES for AUTOMOTIVE WEIGHT REDUCTION
(ÀÚµ¿Â÷ Áß·® °¨¼Ò¸¦ À§ÇÑ ±âŸ ±â¼ú) Design
Technologies (Bodywork Structural Design.
Components Structural Design. Chassis
Design). Structural Analysis Tools.
Simulation Technologies
|
Àü½Ãȸ¸í |
³ª°í¾ß ÀÚµ¿Â÷
ºÎÇ° °¡°ø±â¼ú ¹Ú¶÷ȸ (CAR-MECHA JAPAN NAGOYA 2024) AUTOMOTIVE
COMPONENTS & PROCESSING TECHNOLOGY EXPO |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.automotiveworld.jp/hub/en-gb |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- COMPANIES
dealing with following technology
Press
work. Casting, Forging. Cutting, Grinding
Process. Sheet-metal work. Resin Fabrication.
Surface finishing, Heat treatment
- PROCESSED
PARTS MANUFACTURERS
- PROCESSING
EQUIPMENT MANUFACTURERS
Processing
machine. Molding machine
- CONTRACTORS
|
Àü½Ãȸ¸í |
³ª°í¾ß SDV ¹Ú¶÷ȸ (SOFTWARE-DEFINED
VEHICLE EXPO 2024) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.automotiveworld.jp/hub/en-gb |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- SOFTWARE
DEVELOPMENT TOOLS
- TESTING/VERIFICATION
TOOLS
- SOFTWARE
DEVELOPMENT CONTRACT
- DATA
ACQUISITION/ANALYSIS SOLUTIONS
- CYBERSECURITY
- IN-VEHICLE
OS, MIDDLEWARE
- STAFFING
SOFTWARE/EDUCATION
- CONSULTING
SERVICES
|
Àü½Ãȸ¸í |
³ª°í¾ß ÆÑÅ丮
À̳뺣ÀÌ¼Ç À§Å© (FACTORY INNOVATION WEEK
NAGOYA) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd.
https://www.fiweek.jp/nagoya/en-gb/about.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
ÃÑ3°³ÀÇ
Àü¹® Àü½Ãȸ °³ÃÖ
- RoboDEX
- SMART
FACTORY EXPO
- GREEN
FACTORY EXPO
|
Àü½Ãȸ¸í |
³ª°í¾ß
·Îº¿ ¹Ú¶÷ȸ(RoboDEX NAGOYA 2024) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.fiweek.jp/hub/en-gb/about/robodex.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- INDUSTRIAL
ROBOTS
Assembling. Welding. Delivery.
Polishing. Burring
- SERVICE
ROBOTS
Nursing care. Reception.
Delivery. Cleaning. Security
- SERVICE
USING DRONES
- DEVELOPMENT
TECHNOLOGY
Intelligence/ Control
technologies. Sensing technology. Drive
technology. Electronic component/ Material
|
Àü½Ãȸ¸í |
³ª°í¾ß
½º¸¶Æ® ÆÑÅ丮 ¹Ú¶÷ȸ
(SMART FACTORY EXPO NAGOYA 2024) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.fiweek.jp/hub/en-gb/about/sfe.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- IoT/M2M
SOLUTIONS
Cloud Technologies.
Security Systems. Big Data Technologies.
PLM/PDM/ERP
- FA
EQUIPMENT / INDUSTRIAL ROBOTS
Industrial
Robots. Control Devices (Sensors. Switches).
FA Equipment. AI/Semiconductor
- ENERGY
SAVING / ECO SOLUTIONS
Energy-saving
Lighting. FEMS/Energy Managerment. Energy-saving
Air Conditioner. Industrial Photovoltaic
Generation System
- FACTORY
FACILITIES / EQUIPMENT
Carrier
Devices/AGVs. Security Equipment. Wearable
Devices. Automated Recognition Systems
|
Àü½Ãȸ¸í |
³ª°í¾ß
±×¸°ÆÑÅ丮 ¹Ú¶÷ȸ
(GREEN FACTORY EXPO NAGOYA 2024) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.fiweek.jp/hub/en-gb/about/gfe.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- Automotive,
Automotive Component
- Aviation
Equipment
- Electronic
Device/Component
- Machinery,
Machine Component
- Medicine,
Cosmetics, Food
|
Àü½Ãȸ¸í |
³ª°í¾ß
½º¸¶Æ® ¹°·ù ¹Ú¶÷ȸ
(SMART LOGISTICS EXPO NAGOYA 2024) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.smart-logistic.jp/nagoya/en-gb.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
- AGV/AMR/Collaborative
Robot
- IoT
Solution
- AI
Solution
- WMS/TMS
- Digital
Picking System
- ADAS
for Trucks
- Peripherals
|
Àü½Ãȸ¸í |
³ª°í¾ß
ÀüÀÚ Á¦Á¶ ¹Ú¶÷ȸ
(NEPCON R&D AND MANUFACTURING NAGOYA) |
°³ÃֱⰣ |
2024 ³â 10
¿ù 23 ÀÏ ~ 10 ¿ù 25 ÀÏ |
Àü½ÃÀå¼Ò |
Portmesse
Nagoya |
ÁÖ
ÃÖ |
RX Japan
Ltd. https://www.nepconjapan.jp/nagoya/en-gb.html |
°³ÃÖ±Ô¸ð |
¾à
640 Exhibitors (µ¿½Ã°³ÃÖ¹Ú¶÷ȸ Æ÷ÇÔ) |
Âü°ü°´¼ö |
¾à
37,000 ¿©¸í Âü°¡ |
Àü½ÃÇ°¸ñ |
¸¶¿îÅÍ,
Å×½ºÆ® Àåºñ, ÀüÀÚºÎÇ°/Àç·á, PCBµî°ú °°Àº
ÀüÀÚ R&D ¹× Á¦Á¶ °ü·Ã ÃֽŠ±â¼ú°ú Á¦Ç°µéÀÌ
¸ðÀÌ´Â ÀϺ» ÃÖ°íÀÇ Àü½Ãȸ.
- MOUNTERS
/ MANUFACTURING EQUIPMENT
(¸¶¿îÅÍ
/Á¦Á¶ Àåºñ) Mounters. Dispensers.
Soldering Machines/Materials. Sealing
Machines. Washing Machines. Laser Processors.
EMS/Contract Manugacturing Services.
Clean/ESD Protection Products., Factory/Facility
Equipment
- TESTING
/ MEASURING DEVICES (Å×½ºÆ® / ÃøÁ¤ ÀåÄ¡)
Inspection Equipment.
X-ray Inspection Equipment. Testers.
Analysis Equipment. Software. Measurement
Equipment. Reliability / Evaluation Inspection
Equipment. CCD Cameras. Non Destructive
Inspection Equipment. Contract Analysis
Services
- SEMICONDUCTOR
/ SENSOR PACKAGING TECHNOLOGIES
(¹ÝµµÃ¼
/ ¼¾¼ ÆÐŰ¡ ±â¼ú) Assembly
Equipment. Packaging Materials/Components.
Analysis/Simulation Software for IC
Packaging. Semiconductor Device Inspection
Equipment. SATS/Contract Design Services.
Plating/Etching Materials/Equipment.
MEMS Device Manufacturing Equipment
- ELECTRONIC
COMPONENTS, MATERIALS (ÀüÀÚ ºÎÇ°, Àç·á)
Connector&Cable.
Sensor. Terminal Block. Switches. Resistors.
Transformers. Materials for Mounted
Circuit. Nano Technology Materials
- PRINTED
WIRING BOARDS (Àμ⠹輱 ±âÆÇ)
RIgid PCBs. Multi-layered
PCBs. Flexible PCB. Multi-layered Flexible
PCBs. Flexible Rigid PCBs. Built-up
PCBs. Semiconductor Packaging PCBs.
Optical PCBs. CAD/CAM/CIM
- FINE
PROCESS TECHNOLOGIES (Á¤¹Ð °øÁ¤ ±â¼ú)
Press Work.
Cutting/Drilling. Fine/Precision Sheet-metal
Processing, Metal Molding. Electroforming.
Fine Casting. Mirror Grinding. Laser
Processing. Processing/Molding. Difficult-to-cut-Materials
Processing
- LED
/ LASER DIODE DEVELOPMENT TECHNOLOGIES
(LED
/ ·¹ÀÌÀú ´ÙÀÌ¿Àµå °³¹ß ±â¼ú) LEDs.
Laser Diodes. Optical Components/Materials.
Optical Design Softwear. Thermal Solutions.
Power Supplies. IC. Manufacturing /
Inspection
Equipment
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