동경 조명 박람회(LED/ OLED Light Expo)

동경 조명 박람회(LED/ OLED Light Expo) 동경 조명 박람회(LED/ OLED Light Expo)

1. 전시회명 : 동경 조명 박람회(LED/ OLED LIGHT EXPO)

	LED/ OLED Light Expo (동경 조명 박람회)
	INTERNEPCON JAPAN (동경 전자제조 및 SMT 박람회)
	ELECTROTEST JAPAN (동경 전자계측 및 테스트 박람회)
	IC Packaging Technology Expo (동경 반도체 패키징기술전)
	Electronic Components Expo (동경 전자부품 박람회)
	PWB-PRINTED WIRING BOARDS EXPO (동경 인쇄회로 박람회)
	FINE PROCESS TECHNOLOGY EXPO (미세 공정 기술 박람회)
	WEARABLE DEVICE TECHNOLOGY EXPO (웨이러블 장비 기술 박람회)
	Int'l Automotive Electronics Technology (동경 자동차 전자기술 박람회)
	EV & HEV JAPAN (동경 전기 및 하이브리드 박람회)
	Weight Reduction Expo (동경 경량화 박람회)
	Connected Car JAPAN (동경 커넥티드카 박람회)
	Automotive Componets Processing Technology Expo (자동차 부품 가공 기술 박람회)
	LED/ OLED Lighting Technology Expo (동경 조명기술 박람회)
	DESIGN LIGHTING TOKYO (동경 디자인 조명 박람회)

2. 박람회 안내

전시회명	동경 LED/OLED 조명 박람회 (LED/OLED Light Expo)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	http://www.light-expo.jp/en/
개최규모	약 1,950 여개사 / 약 61,896 여명 참관(동시 개최포함)
전시품목	LED/OLED lighting for housing. Tube-type LED light. LED street light. LED Panel/Display. Embedded LED lighting. In-car LED. LED/OLED lighting for office. Outdoor LED lighting. LED lighting for factory. LED Module. LED for show. LED for plant factory. Other LED/OLED lighting, etc. Lighting Control System Zone Lighting Control Solution. Cloud Server. Switch. Lighting Control Console. Display Panel. Wireless Communication System. Motion Sensor. Controller. BEMS(Building and Energy Management System). Monitoring Device. Management Server. Dimmer. Annunciator. Cable. Illuminance Sensor. IP Camera. Relay. Remote Control.

전시회명	동경 전자제조 및 SMT 박람회 (INTERNEPCON JAPAN )
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd http://www.nepcon.jp/en/
전시품목	Mounters. Cream Solder Printers. Dispensers. Carrier Tapes. Parts Feeders. Marking System / Ink. ERP / SCM. Punching / Pressing Machines. Sealing Machines. Washing Machines. Electromechanical Parts. Various Tools. Various Software. Rework / Repairing Machines. Masks. Taping Machines. Carrier Tape Forming Equipment. Laser Processors. Precision Welders. Production / Factory Control, Regulating Systems. PCB Separators. Cable Ties. Inspection / Testing / Measuring Equipment. Electronic Materials. Other Related Products. Soldering Zone Soldering Machines. Reflow Machines. Rework Machines. Soldering Irons. Soldering Baths. Fluxers. Soldering Materials / Flux EMS/Contract Manufacturing EMS (Electronics Manufacturing/Production Services). Employment/Temp Services (Engineers). Turnkey Factory/Solutions. Consulting Services. Various Outsourcing Services, etc. Clean/ESD Protection Zone Clean Room system. Clean Booths. Air Showers. Particle Counters. Ionizers. ESD/Antistatic Products. Clean Room Supplies. Wiper/wiping Cloths. Cleaners, etc. Factory/Facility Equipment Zone Factory Environmental Measures / Recycle-related Products. Factory/Facility Equipment. Environment-friendly Products / Recycling-related Products. Storage Containers(Racks, Cabinets, others). Various Tools

전시회명	동경 전자계측 및 테스트 박람회(ELECTROTEST JAPAN)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.electrotest.jp/en/
전시품목	Board Vision Inspection Equipment . Solder Vision Inspection Equipment. Infrared Test Equipment . X-ray Inspection Equipment . Ball Machine Vision Inspection Equipment . TAB Vision Inspection Equipment. Bump Vision Inspection Equipment. IC / PCB / Components Vision Inspection Equipment . Lead Frame Vision Inspection Equipment. BGA / CSP Rework System / Equipment . Boundary-scan Testers . In-Circuit Testers . Functional Solder Testers. Testing Sockets for BGA, CSP. IC / LSI Testers. Bare Board Testers. Inspection jig / Test Fixtures / Probes / Testing Stages . Burn-in Equipment. 2-D / 3-D Inspection Equipment. Film Thickness Measurement Equipment. Environmental Test Equipment. Reliability / Evaluation Inspection Equipment . Analysis Equipment / Software. Various Measurement / Inspection / Analysis Devices. Other Various Testers, Inspection, Measurement Equipment and Devices. Contract Analysis Services . CCD Cameras / Other Cameras for Testing. Lenses X-rays/Gamma Radiation Inspection Ultrasonic Inspection Penetrant Inspection Acoustic Emission Testing Infrared Light Testing Magnetic Particle Inspection Eddy Current Inspection

전시회명	동경 반도체 패키징 기술전 (IC PACKAGING TECHNOLOGY EXPO)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.icp-expo.jp/en/
전시품목	Assembly Equipment Wire Bonders .Die Bonders. FC Bonders. Other Various Bonders. Molding Machines . Resin Coating Machines.Dicing Machines . Lead Processing Machines .Laser Processors. Other Equipment for IC Packaging Packaging Materials/Components Sealant (Mold Materials)/Under-fill Materials .ACF/NCF, ACP/NCP .Die Adhesives .Lead Frames. Bonding Wires .Tape Materials . Soldering Balls/Materials. Bump Materials .Packaging Substrates(PCBs, Tape Substrates, Ceramic Substrates, etc.) .Other Materials/Components Analysis/Simulation Software for IC Packaging Analysis Services/Software .Simulation Software . Various Software, etc. Various Packages CSP .BGA . Wafer Level CSP .MCM, etc. Semiconductor Device Inspection & Testing Zone Memory Testers. SoC Testers. IC Test Sockets .IC Test Clips. Inspection Connectors .Burn-in Inspection Equipment .(Reliability Test, Thermal Resistance Test). IC Vision Inspection System . Bump Vision Inspection System . X-ray Inspection Equipment. Circuit Modification System/Software. efect Analysis System/Software . Measurement Equipment .Test Services .Analysis Services .Handlers .Probe Cards.Probes 　etc. SATS/Contract Design Services Zone Semiconductor .LED Packaging Solutions. Sensor Module Assembly. Mounting, Packaging Solutions. MEMS Device Packaging Solutions. Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc. Plating/Etching Zone Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.Plating Materials/Chemicals/Equipment. Plating Process .Etching Chemicals/Equipment. Etching Process .Inspection Equipment. Surface Processing Technology/Related Products, etc. MEMS Packging Zone MEMS Device Manufacturing Equipment Molding Machines Evaluation/Measurement/Testing Equipment MEMS Packaging Materials MEMS Foundry Services Design Tools, Analysis and Simulation Software Other Various MEMS Packaging Technologies

전시회명	동경 전자부품 박람회 (ELECTRONIC COMPONENTS&MATERIALS EXPO)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.eletrade.jp/en/
전시품목	Condenser/Capacitor. Resistor. Filter. Relay. Motor. Connector & Cable. Inductor/Coil. Transformer. Crystal Devices. Fuse. IC. Thermal Design/Noise Reduction Components. Other Component & Device etc. General Electronic Components Condensers/Capacitors. Transformers/Inductors/Coils. Resistors. ICs. Filters. Resonators/Oscillators. Crystal Related Products. LEDs. Switches. Relays. Magnetic Contactors/Circuit Breakers. Memory Cards. Various Acoustic Components. Various Fuses. Various Motors. Various Modules. Various Sensors. Switching Power Sources. Various Batteries etc.

전시회명	동경 인쇄회로 박람회(PWB-PRINTED WIRING BOARDS EXPO)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.pwb.jp/en/
전시품목	PWBs/PCBs Rigid PCBs .Multi-layered PCBs. Flexible PCBs. Multi-layered Flexible PCBs .Flexible Rigid PCBs. Built-up PCBs. Semiconductor Packaging PCBs. TOB/COF PCBs .Optical PCBs .EPD (Embedded Passive Devices) .Other PCBs Design/Development Tools Zone Gathering Design/Development Tools from Functional Design Tools to Simulation Tools and CAD/CAM. Functional Design/Logic Design Tool .Pattern/Layout Design Tool .CAD/CAM/CIM .Transmission Line Simulator . SI/PI/EMC Analysis .Heat Analysis .Design Data Control Tool

전시회명	동경 미세공정 기술 박람회 (FINE PROCESS TECHNOLOGY EXPO)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.fp-expo.jp/en/
전시품목	Press Work / Cutting / Drilling Fine/Precision Sheet-metal Processing Fine Casting / Metal Molding, Electroforming Fine Bonding / Etching / Coating / Polishing, Mirror Grinding Deburring / Plating / Laser Processing Processing, Molding / Energizing, Insulating Difficult-to-cut Materials Processing Plastic Processing / Heat Treatment Prototype Manufacturing Others

전시회명	동경 웨어러블 장비 기술 박람회 (WEARABLE DEVICE TECHNOLOGY EXPO)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.wearable-expo.jp/en/
전시품목	Display Electronic Components Battery/Power Transmission Technology Data Analysis/Management Technology Sensor Semiconductor High Performance Material Wireless Distribution Technology Wearable Device/Item, etc

전시회명	동경 자동차 전자기술 박람회(Int'l Automotive Electronics Technology)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd.http://www.car-ele.jp/en/
전시품목	Automotive Components & In-vehicle System Engine Control System. In-vehicle Networking System. Safety/Comfort Control System. Communication/ITS-related System. Chassis Control System　etc. Semiconductors, Electronic Components & Devices In-vehicle Semiconductors. Sensors. Batteries. In-vehicle PCBs. Camera Modules. Capacitors/Condensers. Connectors/Cables/Harnesses. Resistors. Touchpanels/Display Modules (LCD/FED/VFD). Communication Modules. Fine Processing Technologies　etc. Testing Technologies ECU Testing Tools/Software. Testing, Inspection and Analysis Devices/Software for In-vehicle Networking System. ECU Diagnosis and Verification Services. CAE Software Debuggers　etc. ECU Manufacturing & Testing Technology ECU Manufacturing. SMT Materials. Inspection Equipment. Contract SMT / Contract Manufacturing Services　　etc. In-vehicle Software Development Development Tools. Testing, Inspection. Contract Development etc. Driver Assistance/Autonomous Driving System ADAS. Radars. Sensor Modules. Camera Modules. Image Processing System. Semiconductors, IC. In-vehicle OS. R&D Support Tools/Services. EMC/Noise Reduction EMC Components. Testing & Measuring Equipment. Design & Simulation Technologies. Anechoic Chambers, etc. Thermal Management Technology Thermal Management Materials. Thermal Management Components. Thermal Design / Analysis Technologies.

전시회명	동경 전기 및 하이브리드 박람회(EV & HEV JAPAN)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.evjapan.jp/en/
전시품목	Drive System HEV/EV Drive System. In-wheel Motor System Rechargeable Batteries, Next-generation Batteries Lithium Ion Batteries .Lithium Polymer Batteries.Thin Film Lithium Ion Batteries.Nickel Metal Hydride (NiMH) Batteries .Nicad Batteries.Components & Materials for Batteries　　etc. Lead Acid Batteries .NaS Batteries .Secondary Air Batteries .Capacitors, Condensers. Battery Manufacturing Technologies　 Motor Technologies Automotive Motors. Parts and Materials. Controllers. Measurement and Simulation. Production Facilities. Inverters, Peripherals Inverters, Converters. Power Devices. Passive Elements. Heat-Resistant Products. Inverter Evaluation and Testing System. Chargers. Connectors, Harnesses. Investers, Peripherals Inverters, Converters / Power Devices / Passive Elements Heat-Resistant Products / Inverter Evaluation and Testing System Chargers Contactless Charging Technologies Battery Swap Technologies EV Quick Chargers　　etc Connectors, Harnesses Charging Connectors / In-vehicle Connectors Wire Harnesses　　etc.

전시회명	동경 경량화 박람회(Weight Reduction Expo)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd. http://www.altexpo.jp/en/
전시품목	Materials High-tensile Steel Sheet. High-strength Rolled Steel Sheet .Aluminum Alloy. Magnesium Alloy. Titanium Alloy. Carbon Fiber. Reinforced Plastic. Thermoplastic Resin. Thermoset Resin. Polycarbonate Resin. Rubber / Thermoplastic Elastomer. Carbon Nanofiber. Ceramics. Lightweight Glass Molding / Processing Technologies, Processing Equipment Press Work. Processing / Molding Equipment, Technology. Laser-welding Equipment, Welding Technology. Casting / Forging Technology. Materials Blending / Bonding Technology Components / Modules Weight-reduced Structural Members using Light-metal Alloy(Body/Chassis Components, Powertrain Components, Battery/Inverter Cases) .Weight-reduced Structural Members using Resin Materials (Exterior Body Panels, Exterior Parts, Interior Parts, Engine Room Components, Fuel Components, Electric Components). Others Other Technologies for Automotive Weight Reduction Design Technology (Bodywork Structural Design, Components Structural Design, Chassis Design). Structural Analysis Tools/ Simulation Technologies etc.

전시회명	동경 커넥티드카 박람회(Connected Car JAPAN)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd http://www.connected-car.jp/en/
전시품목	Telematics Development Environment/tool In-vihicle Operatinf system Human Machine Interface Voice control / Motion Recognition / Touch Screen. stc Communication Module Security system Telematics Service Driving Management System. Driving Management System. Eco-Friendly Driving System, etc Drive Recoder / Digital tachograph system Autonimous Driving system Related Technology Communication System / Camera Module, etc

전시회명	동경 자동차 부품 가공기술 박람회 (Components Procdding Technology Expo)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	Reed Exhibitions Japan, Ltd http://www.actpt.jp/en/
전시품목	Prexx work / Casting/Fording Cutting/grinding Process Sheet-metal work Resin fabrication / Surface finishng/heat treatment

전시회명	동경 LED/OLED 조명기술 박람회(LED/OLED Lighting Technology Expo)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	http://www.light-technology.jp/en/
전시품목	COMPONENTS MATERIALS Sapphire. Electrode Material .LED Substrate .Ceramic Material. Sealing Material .Resin . Adhesive Material, Paste .Phosphor .Optical Film . Crystal. Substrate .Resist Material. OLED Material. Lead Frame . Bonding Wire. Solder. Mask. Lens. Polarization Plate/Reflector, etc. Thermal Solution Heat-dissipation Board. Heat Sink. Bonding Wire. Heat-resistance Material. Heat-dissipation Sheet. Heat-dissipation Resin. Coating Material . Thermal-conducting Material, etc. Power Supply Switching Supply. UPS. Inverter. Controller LSI, etc.Capacitor. Rectifier Diode. Transformer. Photocoupler. Inductor. Terminal. Noise Suppression Parts. Converter. Series Power Supply. Driver IC. Electrolytic Capacitor. Rectifier Bridge. Switching Element. Coil. Fan. Printed Circuit Board. Fuse Led Wafer Manufacturing Technologies Wire Saw . Polishing Machine. Diamond Cutter .Aluminium Oxidation .Slurry. Transfer Equipment, etc. Lapping Machine .Grinder.Crucible. Diamond Abrasive. Cleaning Equipment Manufacturing Equipment MOCVD Equipment. Epitaxial Growth System. Sputtering Device .Etching Equipment .Dicing Equipment .Processing Equipment. Scribing Equipment. Exposure Device. Wire Bonder .Transfer Robot/System, etc. Vacuum Evaporation System. Annealing Equipment. Resist Processing Equipment .Dispenser. Joining Machine . Flip-chip Bonder. Sealing-process-related Equipment . Die Bonder. Cleaning Equipment Inspection. Measurement. Test. Evaluation Equipment Appearance Inspection System . LED Measuring System . Illuminance Measuring Instrument . Thermal Resistance Measuring Instrument. Evaluation/Analysis Service, etc. Surface Inspection System. Luminance Measuring Instrument .Life Testing Machine. Color Measuring Instrument Lighting Devices LED / OLED, Other Lighting Devices Lighting Control Technologies Driver. Driver IC . Other Lighting Control Devices, etc. Driver Component. Sensor Module Other Lighting Devices Design Tool/Design Software. Product/Technology/Service for Lighting System. Equipment/Component for Lighting Module/Lighting Unit. Various Contract Services, etc.

전시회명	동경 디자인 조명 박람회 (LED/OLED Light Expo)
개최기간	2016년 1월 13일 ~ 1월 15일
전시장소	Big Sight
주 최	http://www.design-lighting.jp/en/
전시품목	Interior lighting Ambient lighting Designers lighting Illumination Exterior lighting Street light Prototype lighting Space design solution Other related products/services　etc.

3. 박람회 참관안내

구분

참관기간

항공

A팀
(특급호텔)

B팀
(1급호텔)

일정

TOKYO DOME

ARIAKE WASHINGTON

제1안

1.13~15

대한항공

별도문의

제2안

1.13~15

아시아나

별도문의

제3안

1.13~15

대한항공

별도문의

제4안

1.13~15

아시아나

별도문의

제5안

1.13~15

대한항공

별도문의

제6안

1.13~15

아시아나

별도문의

제7안

1.13~15

대한항공
부산-나리타

별도문의

제7-1안

1.13~15

에어부산
부산-나리타

별도문의

제8안

1.13~15

JL항공
김포-하네다
(전시집중)

별도문의

제8-1안

1.13~15

별도문의

제8-2안

1.13~15

JL항공
김포-하네다
(전시+관광)

별도문의

제9안

1.13~15

대한항공
김포-하네다

별도문의

제10안

1.13~15

아시아나
김포-하네다

별도문의

제10-1안

1.13~15

아시아나
김포-하네다
(전시+관광)

별도문의

포함내역

왕복항공료. 특급/1급 호텔 (2인 1실 기준). 1억원 여행자 보험. 일정상 식사. 인천공항 이용료(17,000원). 출국납부금(10,000원). 현지공항세. ★ 유류할증료. 전용차량비. 가이드 경비. ★ 가이드 및 기사 TIP

여권 유효기간 6개월 이상 남아야 합니다.

불포함내역

전시장내의 중식.

이용호텔

[A팀] TOKYO DOME HOTEL (특급호텔; 시내중심 위치)

총 43층 규모, 1,006개 객실.
천연온천 라쿠아,도쿄돔 시티 놀이공원 중심으로한 "도쿄돔 시티"에 위치
호텔 주변 도보거리(1분~6분)에 전철역(스이도바시,카스,코라쿠엔역)이 위치, 편리한 대중교통 이용 가능

전객실 무료 VDSL 고속인터넷 회선 이용가능

ADD ; 1-3-61 Koraku,Bunkyo-ku,Tokyo 112-8562
TEL ; +81-3-5805-2111
FAX ; +81-3-5805-2200

[B팀] TOKYO BAY ARIAKE WASHINGTON HOTEL (1급호텔)

아리아케역 도보 3분 거리, 전시장 도보 5분 거리
ADD ; 3-7-11, Ariake, Koto-Ku, Tokyo, Japan
TEL ; (03)5564-0111
FAX ; (03)5564-0525

4. 참관신청방법

신청방법

아래의 참관신청서를 작성후 팩스 (FAX :02-585-1102) 또는 온라인으로 신청하여 주십시오.

1. 온라인 예약은 회원등록 후 신청하실 수 있습니다
2. 신청금 200,000원은 아래계좌로 입금하여 주시고, 잔액은 출발 1주일 전
까지 완불하여 주시면 됩니다
하나은행 374-810031-68904 예금주 : (주)국제박람회여행사
[취소] 출발 7일 전~1일전 취소시 행사비의 20%, 출발당일 취소시 행사비의
50%가 부가 (재정경제부고시)

신청서 양식

신청마감

각 안별 선착순 20명 또는 출발 3주일전 마감

최저
행사인원

10명
최저 행사 인원이 안될 경우 엑스포텔(EXPOTEL) 상품으로 진행합니다.

상담 및 문의

Tel: 02-585-1009 Fax: 02-585-1102
심재철 대표. 김경선 실장 (icetour@icetour.co.kr)

기타 사항

단체 행사 (10인 이상), 기업연수, 업체 방문 수배, 개별 출장 등 문의 하여 주시면 최고의 컨설팅으로 최상의 일정을 준비하여 드리겠습니다.

5. 박람회 참관 일정표

제1안 대한항공(KE) ;
[A팀]전시2일 참관+시내관광 (시내특급호텔-전일정 차량이용)

[B팀]전시2일 참관+시내관광 (1급호텔-전시장 도보5분 거리)

일자	지역	교통편	시간	세부일정	식사
제1일 1/13 (수)	인천 동경	KE703 전용차	08:10 10:10 12:25 오후	인천공항 3층 A카운터 옆 만남의 장소 집결 인천 출발 나리타공항 도착 동경 전자 외 동시개최 박람회 참관 석식후 호텔 CHECK-IN	기내식 석식
제2일 1/14 (목)	동경	전용차	전일	[A팀]호텔 조식 후 동경 전자 외 동시개최 박람회 참관 석식 후 호텔 투숙 *1/14 석식+가이드+차량 포함	호텔식 X 석식
제2일 1/14 (목)	동경	도보	전일	[B팀]호텔 조식 후 동경 전자 외 동시개최 박람회 참관 호텔 투숙 *1/14 석식+가이드+차량 불포함	호텔식 X X
제3일 1/15 (금)	동경 인천	전용차 KE704	오전 13:55 16:35	호텔 조식 후 CHECK-OUT 간단한 시내관광 나리타공항 출발 인천 도착	호텔식 기내식

▶ 호텔

[A팀]TOKYO DOME HOTEL-동경시내 특급호텔. 전일정 차량이용